 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| LX5551 TM (R) 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier & SPDT for 11b/g/n PRODUCTION DATA SHEET KEY FEATURES DESCRIPTION LX5551 is a high-performance WLAN front-end module (FEM) for 802.11b/g/n and other applications in the 2.4-2.5GHz frequency range. LX5551 integrates an advanced InGaP/GaAs Heterojunction Bipolar Transistor (HBT) power amplifier with both input/output impedance matching, and an InGaAs pseudomorphic HEMT (pHEMT) switch, into a single 3x3mm package. The Tx path of LX5551 features a two-stage monolithic microwave integrated circuit (MMIC) power amplifier with active bias circuitry, and 50 input/output matching inside the package. With 3.3V supply voltage and 90mA nominal bias current, the Tx path provides 27dB gain and +18dBm linear output power, with extremely low total EVM (<3%) for 64QAM/54Mbps OFDM. Both gain and power are readily measured at antenna port, with switch insertion loss included. The Rx path of LX5551 includes a low-cost SPDT switch with excellent insertion loss and isolation. It features a very low Tx-to-Rx port leakage in receive mode. LX5551 is available in a 16-pin, 3x3mm micro-lead package (MLPQ16L). With its best-class performance and compact footprint, LX5551 offers an ideal front-end solution for the ever demanding design requirements of today's WLAN systems, including 802.11b/g and the latest 11n MIMO implementation. WWW .Microsemi .C OM 2.4-2.5GHz 11b/g/n Front-End Solution in a Single 3x3mm MLP Package All RF Ports Matched to 50 Single-Polarity 3.3V Supply Tx Path Power Gain ~ 27dB Rx Path Loss ~ 0.6dB Pout ~ +18dBm at Antenna* for EVM = 3% Total Current ~140mA for +18dBm with 90% Duty Cycle Pout > +22dBm for 11b 1Mbps DSSS Mask Compliance 2 Small Footprint: 3x3mm Low Profile: 0.9mm RoHS Compliant & Pb-Free * Including SPDT switch loss APPLICATIONS IEEE 802.11b/g IEEE 802.11n MIMO BLOCK DIAGRAM IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com Vref Vc Ctl1 Ctl2 TxIn Det RxOut Internal OMN* Antenna *OMN: Output Matching Network LX5551 LX5551 Copyright (c) 2008 Rev. 1.0, 2008-12-17 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX5551 TM (R) 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier & SPDT for 11b/g/n PRODUCTION DATA SHEET PRODUCT HIGHLIGHT WWW .Microsemi .C OM MSC 5551 720A PACKAGE ORDER INFO LQ Plastic MLPQ 16 pin 3x3mm RoHS Compliant /Pb-Free LX5551LQ Note: Available in Tape & Reel. Append the letters "TR" to the part number. (i.e. LX5551LQ-TR) ABSOLUTE MAXIMUM RATINGS PACKAGE PIN OUT Vcc Open 16 15 DC Supply Voltage, RF off (PA).......................................................................5V (Switch) ................................................................5V Collector Current (PA)................................................................................500mA Total Power Dissipation....................................................................................2W RF Input Power............................................................................................10dbm Maximum Junction Temperature (Tj max) ................................................ +150C Operation Ambient Temperature ...................................................-40C to +85C Storage Temperature....................................................................-65C to +150C RoHs/Pb Free Peak Package Solder Reflow Temperature (40 seconds maximum exposure)..................................................................260C(+0, -5) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. Vc1 Open 14 13 12 11 TxIn Vref Det RxOut 1 2 Vc2 Open PAOut SwIn 3 10 4 5 6 7 8 9 Ctl1 Ant Ctl2 Optional LQ PACKAGE ("See-Through" View from Top) PACKAGE DATA PACKAGE DATA THERMAL DATA RoHS/Pb-free 100% Matte Tin Lead finish LQ Plastic MLPQ 16-Pin 17C/W 55.2C/W THERMAL RESISTANCE-JUNCTION TO CASE, JC THERMAL RESISTANCE-JUNCTION TO AMBIENT, JA Junction Temperature Calculation: TJ = TA + (PD x JA). The JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. Copyright (c) 2008 Rev. 1.0, 2008-12-17 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 TM (R) WWW .Microsemi .C OM INFORMATION Thank you for your interest in Microsemi(R) Analog Mixed Signal products. The full data sheet for this device contains proprietary information. To obtain a copy, please contact your local Microsemi sales representative. The name of your local representative can be obtained at the following link http://www.microsemi.com/contact/contactfind.asp or Contact us directly by sending an email to: IPGdatasheets@microsemi.com Be sure to specify the data sheet you are requesting and include your company name and contact information and or vcard. We look forward to hearing from you. Copyright Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 |
Price & Availability of LX5551
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |